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半導體產業報告
中國半導體封裝市場研究報告(2014/2015版)
出自:SEMI中國

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金鑫(86.21.60278553, [email protected]

《中國半導體封裝市場報告2014/2015》簡介

隨著《國家集成電路產業發展推進綱要》的實施和推動,2014年中國集成電路產業已經達到491億美元的規模,其中封裝產業依然以年均增長率19%的成長率貢獻了接近一半的營收。截至2014年,全球封裝材料市場已經達到199.3億美元,中國封裝市場以全球最高的復合增長率就占據了全球約20%的市場;另外,中國的封裝設備市場也占全球封裝設備市場的30.4%。

SEMI? 中國近期完成了關于針對中國半導體封裝市場的深入研究報告,收集調查了超過140家中國封裝廠以及分立器件公司的經營資料,并調查了主要多家封裝材料和設備的供應商,以確保此份報告的準確性和前瞻性。


?
此份報告回答了以下關鍵問題:
??全球經濟發展的形式下中國半導體封裝市場的發展狀況;
??近幾年出臺了的國家政策對半導體及封裝行業有什么導向和影響;
??2013-2015年中國封裝廠所發生的重大并購事件和建廠狀況;
??2005-2019年全球以及中國封裝材料的銷售情況以及市場預估;
??最新中國封裝材料和設備供應商的發展情況。

關于本報告更多信息請聯絡SEMI中國半導體產業資深分析師Shanshan Du ,[email protected]

主要內容

China Semiconductor Packaging Market Outlook

1.?? INTRODUCTION
1.1?Methodology
????? Table 1.1 Companies Interviewed?
1.2?Assumptions
????? Table 1.2 Currency Exchange Rates
1.3?Report Organization

2.?? BACKGROUND OF CHINA SEMICONDUCTOR PACKAGING MARKET
2.1?China Macro Economy & Electronic Product Manufacture
????? Table 2.1 China Electronic Product Market
????? Figure 2.1 China GDP & GDP Growth Rate (2000-2015Q3)
2.2?China Government’s Policy on Semiconductor Industry and Packaging &Testing
??????Figure 2.2 Central Government Policy on Semiconductor Industry
??????Table 2.2 National guideline targets for Semiconductor Industry
??????Table 2.3 Major Investment of China National IC Fund
??????Table 2.4 Announced Local Investment IC Fund summary
2.3?China Semiconductor Industry
??????Figure 2.3 China Semiconductor Industry Revenue
????? Table 2.5 China Semiconductor Industry Revenue by Segment

3.?? CHINA SEMICONDUCTOR PACKAGING INDUSTRY OUTLOOK
3.1?Semiconductor Packaging and Assembly Companies in China
??????Figure 3.1 Package Company Demographics by Category
????? Table 3.1 World Top Ten OSAT Facilities in China
????? Table 3.2 World Top Ten IDM P&T Facilities in China
????? Figure 3.2 Package Company Demographics by Locations
????? Figure 3.3 Map of Leading Package and Test Plants in China
????? Figure 3.4 China-Based Leading Packaging House Revenue Trend
3.2?Semiconductor Packaging and Assembly Activities in China 2013~2015
3.3?Advanced Package (Bumping/WLCSP & TSV) in China
????? Table 3.3 Companies with Bumping/WLCSP/TSV Lines in China
??????Table 3.4 Domestic WLP Equipment Suppliers
3.4?Key Domestic Semiconductor Discrete Companies & Package Capabilities
???? Table 3.5 Key Domestic Semiconductor Discrete Companies

4.?CHINA PACKAGINIG AND ASSEMBLY MATERIALS & EQUIPMENT OUTLOOK
4.1?China Packing Materials Market Overview
????? Figure 4.1 Packaging Materials Market Size by Region
????? Figure 4.2 Key Packaging Material Suppliers in China
????? Figure 4.3 China Packaging Materials Market by Segment
4.1.1 Leadframe Market in China
????? Figure 4.4 Leadframe Market Trends
??????Table 4.1: Leadframe Manufacturing Facilities in China
??????Table 4.2: China-headquartered Leadframes Suppliers
4.1.2 Substrate Market in China
?????Table 4.3: Applications and major supplier for Different Substrate Types
?????Figure 4.5 Substrate Market Trends
???? Table 4.4: Key domestic Substrate Suppliers and their status at 2014
4.1.3 Mold compound Market in China
???? Figure 4.6 Mold compound Market Trends
???? Table 4.5: Key Mold Compound Supplier in China
4.1.4 Bonding Wire Market in China
?????Figure 4.7 Bonding Wire Market Trends
???? Figure 4.8 Bonding Wire Market Trends in China by volume
???? Table 4.6: 2014 Ranking of Wire Supplier in China
4.1.5 Trends and Opportunities for Domestic Packaging Material Suppliers
4.2?China Packaging and Assembly Equipment Market Outlook
?????Table 4.7 Difference between China Assembly Equipment and Worldwide Equipment Market
???? Table 4.8 China Assembly Equipment Market vs China Manufactured
???? Table 4.9 2014 Ranking of Assembly Equipment Makers

5.?SUMMARY AND CONCLUSIONS

6.?APPENDICES
??? Appendix A: List of Acronyms and Abbreviations
??? Appendix B: List of Figures and Tables
??? Appendix C: Excel Workbook

 

 

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文章收入時間: 2016-03-21
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